Transition Metals
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Copper slug, 6.35mm (0.25 in.) dia. x 12.7mm (0.50 in.) length, 99.996% (metals basis), Thermo Scientific Chemicals
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
Hafnium foil, 0.025mm (0.001in) thick, 99.5% (metals basis excluding Zr), Zr nominal 3%, Thermo Scientific Chemicals
CAS: 7440-58-6 Molecular Formula: Hf Molecular Weight (g/mol): 178.49 MDL Number: MFCD00011032 InChI Key: VBJZVLUMGGDVMO-UHFFFAOYSA-N Synonym: hafnium, elemental,hafnio,celtium,unii-x71938l1do,and compounds,hsdb 552,powder,foil,atom,wire PubChem CID: 23986 ChEBI: CHEBI:33343 IUPAC Name: hafnium SMILES: [Hf]
| PubChem CID | 23986 |
|---|---|
| CAS | 7440-58-6 |
| Molecular Weight (g/mol) | 178.49 |
| ChEBI | CHEBI:33343 |
| MDL Number | MFCD00011032 |
| SMILES | [Hf] |
| Synonym | hafnium, elemental,hafnio,celtium,unii-x71938l1do,and compounds,hsdb 552,powder,foil,atom,wire |
| IUPAC Name | hafnium |
| InChI Key | VBJZVLUMGGDVMO-UHFFFAOYSA-N |
| Molecular Formula | Hf |
Copper wire, 0.64mm (0.025in) dia, Puratronic™, 99.999% (metals basis), Oxygen free
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
Copper powder, -625 mesh, APS 3.25-4.75 micron, 99.9% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
Copper foil, 0.025mm (0.001in) thick, annealed, uncoated, 99.8% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
| Name Note | 2.54cm (1.0 in.) dia. x 61cm (24 in.) long |
|---|---|
| Percent Purity | 99% |
| MDL Number | MFCD00144065 |
| Chemical Name or Material | Graphite rod |
| TSCA | Yes |
| Recommended Storage | Ambient temperatures |
| EINECS Number | 231-955-3 |
| Assay Percent Notes | (metals basis) |
| Weight | ≈590g/pc |
Copper rod, 2.0mm (0.08in) dia, 99.99% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
Copper foil, 1.0mm (0.04in) thick, Puratronic™, 99.999% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
Copper plate, 6.35mm (0.25in) thick, 99.9% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
| Name Note | 0.5mm (0.02 in.) dia. |
|---|---|
| Form | Wire |
| Health Hazard 3 | P201-P202-P260-P264b-P270-P272-P280g-P281-P302+P352-P308+P313-P333+P313-P363-P501c |
| MDL Number | MFCD00801098 |
| Solubility Information | Insoluble in water. |
| Health Hazard 1 | H317-H350-H372 |
| Chemical Name or Material | Copper Nickel wire |
| TSCA | Yes |
| Recommended Storage | Ambient temperatures |
| Weight | ≈1.75g/m |
| Avg. Mol. Wt. or Mol. Wt. Range | Cu:Ni 55:45 wt% |
Copper powder, spherical, -100 mesh, 99.5% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
Copper plate, irregular, nominal 10x34x0.6cm (4x13.5x0.25in), Puratronic™, 99.999% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
Copper rod, 19mm (0.8in) dia, Puratronic™, 99.999% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
Copper wire, 0.25mm (0.01in) dia, Puratronic™, 99.9985% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |